BM310B is mainly applied to the appearance inspection of semiconductor discrete devices, integrated circuits and LEDs, and makes it possible to measure the dimensions of die, wire, AI strip, Clip, bond and detect their defects
Leadframe size
25-100mm
False call rate
≤0.05%
Precision measurement and detection
Gain customer recognition for high-precision detection performance and reliable automation integration
Excellent accuracy
意昂体育官方入口
High efficiency
意昂平台app官方下载
Strong compatibility
Support the inspection of Au/Cu/Al wire products; serve semiconductor and LED industries